Semiconductor & Electronics
Ultra-clean, particle-controlled components for vacuum and process tools
Vacuum chamber components, wafer handling hardware, electrode assemblies, heat sinks and RF enclosures — machined, cleaned and packed to the particle and outgassing requirements of a fab.
Typical requirements
- Particle-controlled cleaning and packing
- Low-outgassing material selection
- Helium leak testing to 1e-9 mbar·l/s
- Flatness 0.005 mm on thermal interfaces
- Plating thickness verified by XRF
Components we machine
Cleanliness is a manufacturing requirement, not a wish
In a semiconductor fab a single particle ruins a wafer. Parts destined for process tools are machined with dedicated tooling, cut with filtered coolant, cleaned in a multi-stage ultrasonic line with DI water, and packed double-bagged in a controlled area.
Vacuum compatibility
Surfaces exposed to vacuum are machined to controlled Ra, electropolished where specified, and free from cutting fluids that outgas. Helium leak testing to 1 × 10⁻⁹ mbar·l/s is available on welded and sealed assemblies.
Materials are selected for low outgassing: 6061-T6, 316L, Ti Gr2, oxygen-free copper C101, alumina and PEEK. We avoid free-machining grades with sulphur or lead inclusions where the specification prohibits them.
Flatness and thermal interfaces
Cold plates, heater platens and chuck bases need flatness that holds under thermal load. We grind and lap to 0.005 mm over 300 mm and verify with a calibrated optical flat or CMM scanning routine.
RF and EMI hardware
Waveguide flanges, RF enclosures and shielding require surface conductivity, tight gasket-groove tolerances and plated finishes. We handle silver, gold and tin plating through qualified partners with plating thickness verified by XRF.
Working in this sector?
We can share relevant references and quality documentation under NDA.
- Reviewed by a manufacturing engineer
- NDA available before file exchange